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Dieshot Gallery Process Roadmap Die Size Comparison Core Comparison

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Logic Density SRAM Calculator Lithography Limit DRAM Bit Density Die Layout (OWE / MFU) Die Yield · SemiAnalysis

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Broadcom

Broadcom BCM88870

Codename · BCM88870

Dieshot

Kurnal Insights 2026-10-24

Broadcom BCM88870

Dimensions: 30.97 × 24.22 mm
Area: 750.09 mm²

Sources

Broadcom BCM88870

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