Depth · Precision · Professional
Engineering-grade semiconductor analysis: Die Shot, advanced packaging, CMOS process, memory and process node evolution.
- Reports
- 18
- Die Shots
- 162
- Manufacturers
- 17
Blog & Articles
Industry observations, technical reviews and product updates from working engineers.
计划更新
更新与未来计划
计算器恢复更新
逻辑密度与 SRAM 计算器已恢复，公式与参考数据已重新核对
为什么芯片的面积是这个数据——设计时的SPEC问题
分析与杂谈
Apple M 系列单 Die 价格
M1 → M4 单 Die 制造成本估算
2026 年 3 月视频更新计划
更新计划
TSMC N2P 工艺前瞻
TSMC N2P 工艺前瞻——基于 Synopsys 公开 PDK
Analysis Reports
Per-chip teardown PDFs covering process, packaging, and cell structure — all in one document.
Li Auto M100-Ultra On-Chip Analyze
理想 M100-Ultra 片上分析（Dieshot）
Intel Crescent Island GPU – PCB Analysis
Physical-layer teardown of Intel's Crescent Island data-center AI inference GPU — PCB stack-up, power delivery, GPU package/die estimate, and the LPDDR5X memory subsystem, benchmarked against NVIDIA/AMD reference parts.
Intel Crescent Island GPU – PCB Analysis (Slide Deck)
Slide-format summary of the Crescent Island PCB teardown — company profile, methodology, key measurements and findings at a glance.
Samsung 2nm processor analyze
三星2nm工艺分析
<Not completed> Nvidia GPU SM DATA
Dieshot
Huawei Mate70Pro+CIS(SC580XS)+红枫镜头+UFS+LPDDR
CIS+UFS+LPDDR
Dieshot Gallery
High-resolution die imagery, side-by-side across vendors, processes and eras. One click to zoom in.
