Per-chip teardown PDFs covering process, packaging, and cell structure — all in one document.
理想 M100-Ultra 片上分析（Dieshot）
Physical-layer teardown of Intel's Crescent Island data-center AI inference GPU — PCB stack-up, power delivery, GPU package/die estimate, and the LPDDR5X memory subsystem, benchmarked against NVIDIA/AMD reference parts.
Slide-format summary of the Crescent Island PCB teardown — company profile, methodology, key measurements and findings at a glance.
三星2nm工艺分析
Dieshot
CIS+UFS+LPDDR
基于Redmi Watch 5 ESIM版的 Xring 芯片分析
基于天玑9500的片上分析与本世代产品对比
基于华为Mate70Pro+的麒麟9020的片上分析
封装分析+片上分析+工艺评估
基于Exynos W1000的 三星3nm 工艺分析
Samsung 10nm/8nm processor analyze with Switch2(T239)
Dieshot+SRAM
Switch2 芯片 Die Shot 深度解析
