Qualcomm · Samsung
Qualcomm Automotive SA8255P / SA8650P / SA8775P
Codename · SA8255P
SA8255P(第四代座舱)、SA8650P、SA8775P(第六代 Ride Flex)等车规型号共用同一颗 Die,三星 5nm,裸片 11.93 x 10.89 mm。
Kurnal Insights
- Dimensions
- 11.93 × 10.89 mm
- Area
- 129.92 mm²
- Release Year
- 2023
- Foundry
- Samsung