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Decapsulation

Inside a hexagonal chip package (AS5621L)

A teardown of an unusual hexagonal chip package.

Kurnal Insights

An unusually shaped chip arrived on the bench: a hexagonal package. Let’s start with its exterior.

Package exterior

GM view

GM detail

VI view

Decapsulation results

Opening the package revealed two bare dies inside.

Die 1 — die marking SD3068

SD3068 die at 500× magnification

Another region of the SD3068 die at 500× magnification

Die 2 — die marking JW705J

JW705J die at 500× magnification

Another region of the JW705J die at 500× magnification