Apple A20 Pro

Apple A20 Pro chip analysis report.

Huawei Kirin 9050 with Logic Folding

Huawei Kirin 9050 chip analysis and Logic Folding research.

MediaTek Dimensity 9600 Pro

MediaTek Dimensity 9600 Pro chip analysis report.

Qualcomm Snapdragon 8 Elite Extreme Gen6

Qualcomm Snapdragon 8 Elite Extreme Gen6 chip analysis report.

Li Auto M100-Ultra On-Chip Analyze

理想 M100-Ultra 片上分析（Dieshot）

Intel Crescent Island GPU – PCB Analysis

Physical-layer teardown of Intel's Crescent Island data-center AI inference GPU — PCB stack-up, power delivery, GPU package/die estimate, and the LPDDR5X memory subsystem, benchmarked against NVIDIA/AMD reference parts.

Intel Crescent Island GPU – PCB Analysis (Slide Deck)

Slide-format summary of the Crescent Island PCB teardown — company profile, methodology, key measurements and findings at a glance.

Samsung 2nm processor analyze

三星2nm工艺分析

<Not completed> Nvidia GPU SM DATA

Dieshot

Huawei Mate70Pro+CIS(SC580XS)+红枫镜头+UFS+LPDDR

CIS+UFS+LPDDR

Xiaomi Xring Watch（T1）

基于Redmi Watch 5 ESIM版的 Xring 芯片分析

MediaTek Dimensity 9500

基于天玑9500的片上分析与本世代产品对比

Huawei Kirin 9020 analyze

基于华为Mate70Pro+的麒麟9020的片上分析

Huawei KunPeng 930

封装分析+片上分析+工艺评估

Micron LPDDR5 24GB analyze

Samsung 3nm GAP Processor analyze

基于Exynos W1000的 三星3nm 工艺分析

Samsung 10nm/8nm processor analyze with Switch2(T239)

Samsung 10nm/8nm processor analyze with Switch2(T239)

Apple C1+N1

Dieshot+SRAM

Apple A19 Pro on chip analyze

Dieshot+SRAM

Huawei-Car-Chip-990A&9610A V0.1

Ascend910C-V1

Switch2 analysis report

Switch2 芯片 Die Shot 深度解析