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HUAWEI (HiSilicon) · TSMC

Hisilicon Hi36A0V100 (Kirin 9000)

Codename · Kirin 9000

Dieshot

Kurnal Insights
Mobile SoC 2018 – 2020 TSMC N5 Kirin 9000 Series
Hisilicon Hi36A0V100 (Kirin 9000)
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Dimensions
9.93 × 10.84 mm
Area
107.64 mm²
Release Year
2020
Foundry
TSMC

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Hisilicon Hi36E0 (Kirin 9050) Hisilicon Hi36D0 (Kirin 9030) Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi3630 (Kirin 920) Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3635 (Kirin 930)