Skip to content
Die Shot Gallery
Qualcomm · TSMC

Qualcomm Snapdragon 8Gen5(SM8845)

Codename · SM8845

Dieshot

Kurnal Insights
Qualcomm Snapdragon 8Gen5(SM8845)
Dimensions
8.09 × 12.8 mm
Area
103.55 mm²
Release Year
2024
Foundry
TSMC

More from this maker