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Kurnal Insights
Die Shot Gallery
HUAWEI (HiSilicon) · TSMC

Hisilicon Hi3630 (Kirin 920)

Codename · Kirin 920

Dieshot

Kurnal Insights
Mobile SoC ≤ 2017 TSMC ≥ 10nm Kirin Legacy
Hisilicon Hi3630 (Kirin 920)
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Dimensions
10.75 × 11.05 mm
Area
118.79 mm²
Release Year
2014
Foundry
TSMC

Notes

k920 hi3630 v101

More from this maker

Hisilicon Hi36D0 (Kirin 9030) Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3635 (Kirin 930) Hisilicon Hi3650 (Kirin 950) Hisilicon Hi36C0 (Kirin 9020)