Skip to content
Kurnal Insights
Die Shot Gallery
HUAWEI (HiSilicon) · TSMC

Hisilicon Hi3650 (Kirin 950)

Codename · Kirin 950

Dieshot

Kurnal Insights
Mobile SoC ≤ 2017 TSMC ≥ 10nm Kirin Legacy
Hisilicon Hi3650 (Kirin 950)
Download image
Dimensions
8.2 × 10.69 mm
Area
87.66 mm²
Release Year
2015
Foundry
TSMC

Notes

k950 hi3650 v121 x0.09mm

More from this maker

Hisilicon Hi36D0 (Kirin 9030) Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi3630 (Kirin 920) Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3635 (Kirin 930) Hisilicon Hi36C0 (Kirin 9020)