Skip to content
Kurnal Insights
Die Shot Gallery
HUAWEI (HiSilicon) · TSMC

Hisilicon Hi3635 (Kirin 930)

Codename · Kirin 930

Dieshot

Kurnal Insights
Mobile SoC ≤ 2017 TSMC ≥ 10nm Kirin Legacy
Hisilicon Hi3635 (Kirin 930)
Download image
Dimensions
10.3 × 10.75 mm
Area
110.73 mm²
Release Year
2015
Foundry
TSMC

Notes

k930 hi3635 v111

More from this maker

Hisilicon Hi36D0 (Kirin 9030) Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi3630 (Kirin 920) Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3650 (Kirin 950) Hisilicon Hi36C0 (Kirin 9020)