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Kurnal Insights
Die Shot Gallery
HUAWEI (HiSilicon) · SMIC

Hisilicon Hi36C0 (Kirin 9020)

Codename · Kirin 9020

Dieshot

Kurnal Insights
Mobile SoC 2024 SMIC / Other Kirin 9000 Series
Hisilicon Hi36C0 (Kirin 9020)
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Dimensions
12.89 × 10.9 mm
Area
140.5 mm²
Release Year
2024
Foundry
SMIC

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Hisilicon Hi36D0 (Kirin 9030) Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi3630 (Kirin 920) Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3635 (Kirin 930) Hisilicon Hi3650 (Kirin 950)