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HUAWEI (HiSilicon) · SMIC

Hisilicon Hi36D0 (Kirin 9030)

Codename · Kirin 9030

Dieshot

Kurnal Insights
Mobile SoC era-2025 SMIC / Other Kirin 9000 Series
Hisilicon Hi36D0 (Kirin 9030)
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Dimensions
12.95 × 10.94 mm
Area
141.67 mm²
Release Year
2025
Foundry
SMIC

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Hisilicon Kirin X90& Kirin 9610A Hisilicon Hi3630 (Kirin 920) Hisilicon Hi6260V100 (Kirin 710)(TSMC) Hisilicon Hi3635 (Kirin 930) Hisilicon Hi3650 (Kirin 950) Hisilicon Hi36C0 (Kirin 9020)