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HUAWEI (HiSilicon) · SMIC

Hisilicon Hi36A0V120 S (Kirin 9000S)

Codename · Kirin 9000S

Dieshot

Kurnal Insights
Mobile SoC 2023 SMIC / Other Kirin 9000 Series
Hisilicon Hi36A0V120 S (Kirin 9000S)
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Dimensions
10.7 × 10.4 mm
Area
111.28 mm²
Release Year
2023
Foundry
SMIC

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