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HUAWEI (HiSilicon) · SMIC

Hisilicon Hi36A0V121 (Kirin 9010)

Codename · Kirin 9010

Dieshot

Kurnal Insights
Mobile SoC 2024 SMIC / Other Kirin 9000 Series
Hisilicon Hi36A0V121 (Kirin 9010)
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Dimensions
10.578 × 10.719 mm
Area
113.39 mm²
Release Year
2024
Foundry
SMIC

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