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HUAWEI (HiSilicon) · TSMC

Hisilicon Hi6290(Kirin 985&Kirin 820)

Codename · Kirin 985&Kirin 820

Dieshot

Kurnal Insights
Mobile SoC 2018 – 2020 TSMC N6 / N7 Kirin Legacy
Hisilicon Hi6290(Kirin 985&Kirin 820)
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Dimensions
9.52 × 7.91 mm
Area
75.3 mm²
Release Year
2020
Foundry
TSMC

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